Job Summary:

Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Backgrind, or DBG processes.

Job Responsibilities:

• Define/optimize procedures to ensure smooth processing of production lots

• Develop and maintain process documentation and SOPs including operator training

• Lead root cause analysis for defects and yield losses

• Provide disposition on lots with quality issues

• Support new product introduction and process qualification

• Analyze production data to identify process improvements

• Collaborate with cross-functional teams on cost reduction and process improvement projects

• Perform change management including new material qualification

Qualifications:

• Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).

• 3-5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.

• Strong data analysis and problem-solving skills.

• Experience with Statistical Process Control (SPC) and process validation (preferred).

• With good command of English language.

• Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).