ESSENTIAL

DUTIES AND RESPONSIBILITIES:

The Technical PhD Intern will support machining and lapping process development for next-generation wafer technologies.

• The role offers hands-on experience applying modeling, simulation, data analytics, AI/ML, software, and hardware development to improve process capability, quality, and manufacturing performance.
• Support machining and lapping process development projects.
• Develop and apply modeling and simulation methods to understand process behavior.
• Analyze process and equipment data using statistical and AI/ML techniques.
• Assist in developing software tools, algorithms, and engineering analytics solutions.
• Support experimental design, process characterization, and root cause investigations.
• Collaborate with process, equipment, software, and data engineering teams.
• Document and present technical findings and recommendations.

REQUIRED:

• Currently pursuing a PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Computer Engineering, Physics, Data Science, or equivalent experience
• Internship period must be at least 4 months; can be on-site at Bangpa-in, Ayutthaya

PREFERRED:

• Research experience in machining, lapping, precision engineering, manufacturing processes, or advanced materials.
• Knowledge of Design of Experiments (DOE), statistical analysis, and process optimization.
• Familiarity with sensor systems, automation, or hardware development.

SKILLS:

• Experience in modeling, simulation, data analysis, or computational research.
• Experience with AI/ML, data analytics, or predictive modeling
• Programming experience in Python, MATLAB, C/C++, or similar.
• Strong analytical, problem-solving, teamwork, and communication skills.
• Strong with Root Cause Analysis and Technical Communication
• Strong written and verbal English communication

LI-SB1

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job title

and requisition number of the position for which you are applying.

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