About the Role

We are looking for an experienced Product Engineer / Integrator to join our Semiconductor IC Assembly & Packaging team. This role will be responsible for leading New Product Introduction (NPI) activities from customer design release through qualification and mass production, while working closely with cross-functional teams and global customers.

Key Responsibilities

• Lead New Product Introduction (NPI) projects from customer design release through mass production.

• Coordinate cross-functional teams including Process Engineering, Manufacturing, Quality, Test Engineering, Supply Chain, and Customers.

• Manage project schedules, engineering builds, qualification activities, and production ramp-up.

• Analyze production yield, defect trends, and reliability data to identify improvement opportunities.

• Drive Root Cause Analysis (RCA) and corrective/preventive actions for quality and manufacturing issues.

• Support package development, assembly process qualification, and change management activities.

• Interface directly with customers regarding technical issues, project status, and product releases.

• Review engineering specifications, process flow, FMEA, Control Plan, and qualification reports.

• Monitor product performance, reliability, and SPC data.

• Ensure compliance with automotive and semiconductor quality standards, including IATF 16949, JEDEC, and IPC, where applicable.

Qualifications

• Bachelor's or Master's Degree in: Electrical Engineering, Electronics Engineering, Materials Engineering, Mechanical, Industrial, Semiconductor Engineering, Physics or related fields.

• 2–8+ years of experience in one or more of the following: Semiconductor Assembly / IC Packaging, Product Engineering, NPI Engineering, Manufacturing Engineering, Yield Engineering, Test Engineering, NPI Project Management

• Technical Skills Experience or knowledge in semiconductor assembly processes such as: Wafer Saw, Die Attach, Wire Bond, Flip Chip, Mold, Trim & Form, Singulation, Final Test

• Knowledge of IC packaging technologies such as: QFN, BGA, LGA, FCBGA, SiP

• Additional technical knowledge: Yield Analysis and SPC, Root Cause Analysis (RCA), 8D / 5 Why / Fishbone, FMEA / Control Plan / MSA, Data analysis using JMP, Minitab, Excel, Power BI, or SQL, Reliability and qualification activities, JEDEC standards, HAST / HTOL / Temperature Cycling / MSL

Preferred Qualifications

• Experience in SiP or advanced semiconductor packaging is highly preferred.

• Experience with automotive semiconductor products is an advantage.

• Knowledge of APQP, PPAP, and IATF 16949.

• Six Sigma Green Belt / Black Belt certification is a plus.

• PMP certification is a plus.

• Experience working with multinational semiconductor companies or OSATs is preferred.

Soft Skills

• Strong project management and coordination skills.

• Strong analytical and problem-solving skills.

• Good communication skills with customers and global teams.

• Strong leadership and stakeholder management skills.

• Able to work effectively in a fast-paced semiconductor manufacturing environment.

• Good presentation and technical report-writing skills.

Language

• Good command of Thai and English, with the ability to communicate effectively with global customers and regional engineering teams.

What You Will Do

You will play a key role in driving new product launches, technical integration, qualification, yield improvement, and production ramp-up while working closely with customers and cross-functional engineering teams.

Benefits

• Daily transportation allowance of 30 Baht

• Guaranteed bonus for 2 months

• Performance-based bonus on a quarterly basis

• Monday to Friday work schedule

• Starting annual leave of 13 days

• Language allowance (TOEIC)

• Social security

• Group Insurance

Working location: Sukhumvit 105 (Soi Lasalle), Bangna, Bangkok (BTS - Bearing)

Semiconductor